Multilayer seed pattern inductor, manufacturing method thereof, and board having the same
US11276520B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Nov 26, 2018 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Jun 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2017/048
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.