Radiation-hardened package for an electronic device
US11276619B2 · kind B2 · utility
0Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2018 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Jul 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The package comprises a carrier, an electronic device arranged on the carrier, a shield arranged on the electronic device on a side facing away from the carrier, and an absorber film comprising nanomaterial applied on or above the shield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.