Inverter arrangement
US11276622B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2018 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Jul 25, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B70/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor arrangement and an inverter incorporating the semiconductor arrangement, in particular to an inverter for use with traction power units e.g. for on and off road vehicles and stationary power inversion, are described. In the arrangement, semiconductor devices are thermally and electrically coupled to a heatsink as a module. The heatsink is configured as a bus bar to electrically connect the one or more semiconductor devices together to transmit power between the one or more semiconductor devices. The semiconductor devices may be cooled using the structure to which they are attached, and also immersed in a cooling medium to further increase the cooling of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.