Patent · US Active

Power electronics assembly including a circuit carrier

US11276623B2 · kind B2 · utility

0Cited by

0References

12Claims

0Family size

Assignee

VITESCO TECHNOLOGIES GMBH · DE

Inventors

Erich Mattmann · Heidesheim, DE
Sabine Bergmann · Hattersheim, DE
Roland Brey · Eschlkam, DE
Soeren Rittstieg · Neutraubling, DE

Key dates

Filing date	Feb 18, 2018
Grant date	Mar 15, 2022
Priority date	—
Expiry date	Feb 18, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/83801
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A circuit carrier for holding at least one electrical power component is disclosed. The circuit carrier including a heat sink for holding and for cooling the power component. The heat sink having a surface. The circuit carrier includes a copper layer for mechanically connecting the heat sink to at least one copper plate, where the copper layer includes copper or a copper alloy and is cold-gas-sprayed or sintered on the surface of the heat sink. The circuit carrier also includes at least one copper plate for mechanically and electrically connecting the power component to the copper layer. The copper plate includes copper or a copper alloy and is arranged directly on a surface of the copper layer facing away from the heat sink and is areally, mechanically and electrically conductively connected to the copper layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.