Headphone earcup structure
US11277679B1 · kind B1 · utility
1Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2020 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Sep 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2400/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.