Patent · US Active

Method for mechanical contacting of a potting frame on a printed circuit board

US11277920B2 · kind B2 · utility

0Cited by

1References

6Claims

0Family size

Assignee

Endress+Hauser SE+Co. KG · DE

Inventors

Bernd Strütt · Steinen, DE
Simon Gerwig · Schopfheim, DE
Max Bauer · Rheinfelden (Baden), DE

Key dates

Filing date	Sep 11, 2018
Grant date	Mar 15, 2022
Priority date	—
Expiry date	Sep 11, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1327
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The invention relates to a method for mechanical connecting especially of a potting frame to a printed circuit board of an electrical/electronic module. The potting frame includes a metal contact area. The printed circuit board includes a surface area structured metallically corresponding to the contact area. The method includes positioning the mechanical component with the contact area facing the corresponding surface area, and soldering the mechanical component to the printed circuit board via the contact area and the surface area. The method the advantage that a material saving encapsulation can be provided for electrical/electronic modules in explosion endangered regions. An additional process step for mechanical connecting of the encapsulation to the printed circuit board can be omitted, since the mechanical connecting of the potting frame can be performed in one process step together with the soldering of the additional electrical/electronic components to the printed circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.