Transfer method for manufacturing conductor structures by means of nano-inks
US11278958B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 7, 2015 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | May 7, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12014
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.