Adhesive bondline spacer clip
US11279095B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2021 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Jun 3, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C65/52
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A spacer clip for ensuring a minimum adhesive bond line thickness (T) during an attachment event with an adhesive, the spacer clip including: a spacer element having a thickness (t) defining the minimum bond line thickness, adapted to be arranged interleaved between a first vehicle part and a second vehicle part, a hold portion generally parallel with the spacer element and attached to the spacer element with an interconnecting portion. The spacer clip is mountable on the first vehicle part. The hold portion is adapted to be arranged on an opposite side of the first vehicle part compared to the spacer element. The spacer element and the hold portion are adapted to maintain a pressure on the first vehicle part such that the spacer clip can be mounted on the first vehicle part prior to the attachment event.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.