Heat-curing epoxy resin adhesives
US11279796B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | May 29, 2018 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | May 29, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J163/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat-curing epoxy resin compositions which can in particular be used as bodyshell adhesives for motor vehicle construction. The heat-curing epoxy resin compositions contain a curing agent which can be activated through elevated temperature and has a first component K1 containing at least one epoxy resin and a second component K2 containing at least one tertiary amine and also a primary amine. These compositions, after short-term heating of 30 to 120 seconds at a temperature of 90° C. to 130° C., exhibit sufficient strength and adhesion to withstand transport-induced mechanical strains.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.