Epoxy resin wave-absorbing composite material and preparation method thereof
US11279822B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 26, 2019 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Apr 22, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/40
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure provides an epoxy resin wave-absorbing composite material and a preparation method thereof. The method includes: heating an epoxy resin to 50° C.˜70° C., and adding carbon black, to obtain a mixture of the epoxy resin and the carbon black; heating the mixture of the epoxy resin and the carbon black to 100° C.˜120° C., adding a curing agent, and stirring and dissolving them to obtain a mixture of the epoxy resin, the carbon black, and the curing agent; and adding surface-treated hollow glass microbeads into the mixture of the epoxy resin, the carbon black, and the curing agent, and curing them to obtain the epoxy resin wave-absorbing composite material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.