Poly(phenylene ether) copolymer compositions and associated methods and articles
US11279824B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2018 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Dec 5, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G65/4006
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol and a dihydric phenol in a non-halogenated solvent is useful in curable compositions. The copolymer has less than 0.5 weight percent monohydric phenols having identical substituents in the 2- and 6-positions of the phenolic ring, and an absolute number average molecular weight of 1,000 to 10,000 grams/mole. A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol, 2,6-dimethylphenol, and a dihydric phenol in a non-halogenated solvent is also useful in curable compositions. This copolymer has an absolute number average molecular weight of 1,000 to 5,000 grams/mole. A cured composition is obtained by heating curable compositions composed of the poly(phenylene ether) copolymer solutions and thermoset resins for a time and temperature sufficient to evaporate the non-halogenated solvent and effect curing. The compositions can be used for preparation of composites for printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.