Adhesive film activatable at low temperature
US11279860B2 · kind B2 · utility
0Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2018 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Jul 28, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2475/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention relates to an adhesive composition that can be activated at a low temperature (from 110° C., preferably from 100° C.) and is available in the form of a film, and to the method for the production thereof. The invention also relates to a composition comprising at least one specific polyester polyol and at least one specific polyisocyanate dispersible in said polyester polyol in the presence of at least one specific organic solvent, and to the use of said composition for producing an adhesive composition that can be activated at a low temperature and is available in the form of a film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.