Optical sensor assembly
US11280670B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2020 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Nov 18, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An optical sensor assembly is provided. The optical sensor assembly includes a circuit board, an optical sensor positioned on the circuit board, and a front cover attached to the circuit board and covering the optical sensor. The front cover includes an optical element configured to guide or condense an incident light of a predetermined wavelength onto the optical sensor. The front cover is made of polypropylene or polyethylene. The predetermined wavelength is in a range from 8 micrometers to 12 micrometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.