Serial interface for semiconductor package
US11281603B2 · kind B2 · utility
0Cited by
5References
25Claims
0Family size
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Inventors
Key dates
| Filing date | Aug 3, 2018 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Apr 19, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system for serial communication includes a controller, a semiconductor package comprising a plurality of semiconductor die, and a serial interface configured to connect the plurality of semiconductor die to the controller. The serial interface includes a controller-to-package connection and a package-to-controller connection, and the serial interface is configured to employ a signaling protocol using differential data signaling with no separate clock signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.