Multi-story indoor structured three-dimensional modeling method and system
US11282270B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2020 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Oct 15, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30184
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method, including: 1) inputting a multi-story point cloud, and segmenting a story and an inter-story connection region based on an elevation histogram of the point cloud in a vertical direction; 2) segmenting rooms for each story based on a grid map projected onto an XOY plane respectively, wherein the XOY plane is parallel to a flooring; 3) segmenting indoor space cells for each story based on a vector wall line respectively; constructing a vector indoor plan based on superimposition of the vector and the grid for each story respectively; and 5) establishing a three-dimensional model of a multi-story structure by deleting an overlapping surface between the story and the connection region according to the Boolean intersection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.