Method and apparatus for poling polymer thin films
US11282729B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2019 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Jun 3, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L27/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.