Display substrate having signal vias, method for manufacturing the same, and display device having the same
US11282913B2 · kind B2 · utility
1Cited by
1References
17Claims
0Family size
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Key dates
| Filing date | May 7, 2019 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Sep 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
Abstract
A display substrate having a display region and at least one bonding region located on the periphery of the display region, includes: multiple first signal via holes located in the at least one bonding region and configured to provide bonding lead channels; and multiple second signal via holes located in the display region and configured to provide electrode lead channels. The diameter of each of the first signal via holes is greater than the diameter of any one second signal via hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.