Flip-chip LED chip used in backlight and production method thereof
US11282985B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2019 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Apr 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
Abstract
The present invention discloses a flip-chip LED chip used in a backlight and a producing method thereof. The flip-chip LED chip used in the backlight comprises a substrate, an epitaxial layer, a transparent conductive layer, an insulating layer, a first reflecting layer, a second reflecting layer, a first electrode, and a second electrode. In the present invention, the first reflecting layer and the second reflecting layer are formed on both sides of the substrate. By adjusting the reflectance of the first reflecting layer and the second reflecting layer, the light emitted by the epitaxial layer is reflected by the first reflecting layer and the second reflecting layer, resulting in 20-40% of the light being emitted from the back of the chip, and 60-80% of the light being emitted from the side of the chip. This increases the light uniformity of the LED backlight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.