Electronic device including composite heat dissipation member and method of manufacturing the same
US11284538B2 · kind B2 · utility
0Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2020 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Aug 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/08
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A composite heat dissipation member and an electronic device comprising the composite heat dissipation member. The composite head dissipation member may include a first heat dissipation sheet disposed to be overlapped with an antenna module, and a second heat dissipation sheet disposed adjacent to the first heat dissipation sheet without an overlap with the first heat dissipation sheet, thermally connected to the first heat dissipation sheet, and having a higher thermal conductivity than the first heat dissipation sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.