Mold for forming solder distal tip for guidewire
US11285299B2 · kind B2 · utility
0Cited by
54References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 31, 2019 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Apr 24, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C6/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.