Manufacturing system with thermoforming for a cushioning footwear
US11285657B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2019 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Jan 9, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/504
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A thermoforming system for forming a cushioning pod structure that includes a first and a second thermoforming station with each comprised of a film holder and a thermoforming mold holder. The system implements a thermal source that is moveable between the first thermoforming station and the second thermoforming station such that the film holders are between the thermal source and the respective thermoforming mold holder. The system also relies on intentional application of a vacuum source fluidly coupled to thermoforming stations and a movement mechanism configured to move the thermal source between the first thermoforming station and the second thermoforming station. Additional aspects contemplate the implementation of a positive pressure source to aid in the dislodgment of the formed portion, a cooling system to adjust mold temperatures, and/or a fan to efficiently thermoform the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.