Structural module assembly having overmolded electrically conductive reinforcements
US11285894B2 · kind B2 · utility
0Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2017 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Nov 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W4/48
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A structural module assembly with conductive reinforcements overmolded within the plastic and/or composite subassembly as a main power bus and a communication bus for electrical components assembled onto the module. Control signals are either transmitted between a main microcontroller and another microcontroller by way of the communication bus or wirelessly. The microcontrollers determine which electrical components to activate, and power is provided to the electrical components by way of the main power bus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.