Molding compound having randomly oriented filaments and methods for making and using same
US11286358B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Mar 21, 2018 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Apr 26, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2363/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding compound is made by heat-softening, fusing and compressing strips of unidirectionally aligned filaments embedded in a thermosetting resin. The thermosetting resin is non-tacky at room temperature, which allows for easy handling, elimination of cold storage and the use of robotic manufacturing methods. Composites made by molding the molding compound have excellent, highly isotropic tensile properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.