Polymeric material for use in thermal insulation
US11286362B2 · kind B2 · utility
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22Claims
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Key dates
| Filing date | Jun 6, 2014 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Jun 6, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polymeric material for use in thermal insulation is provided. The polymeric material is formed from a thermoplastic composition containing a continuous phase that includes a matrix polymer and within which a microinclusion additive and nanoinclusion additive are dispersed in the form of discrete domains. A porous network is defined in the material that includes a plurality of nanopores having an average cross-sectional dimension of about 800 nanometers or less. The polymeric material exhibits a thermal conductivity of about 0.20 watts per meter-kelvin or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.