Pressure-sensitive adhesive compositions for manufacturing electronic devices

US11286407B2 · kind B2 · utility

Assignee

• 3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

• John W. McAllister · Okabena, US
• Jingjing Ma · Woodbury, US
• Zhong Chen · Woodbury, US
• Pierre R. Bieber · Goldkronach, DE
• Petra M. Stegmaier · Goldkronach, DE
• Eike H. Klünker · Kaarst, DE

Key dates

• Filing date: Dec 20, 2017
• Grant date: Mar 29, 2022
• Expiry date: Mar 16, 2039

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J2453/00
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for…