Patent · US Active

Cleaning formulation for removing residues on surfaces

US11286444B2 · kind B2 · utility

0Cited by

26References

25Claims

0Family size

Assignee

Fujifilm Electronic Materials U.S.A., Inc. · US

Inventors

Tomonori Takahashi · Chita, JP
Bing Du · Gilbert, US
William A. Wojtczak · Santa Clara, US
Thomas Dory · Gilbert, US
Emil A. Kneer · Mesa, US

Key dates

Filing date	Aug 20, 2020
Grant date	Mar 29, 2022
Priority date	—
Expiry date	Aug 20, 2040

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC11D2111/22
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 4) at least one pH adjusting agent, the pH adjusting agent being a base free of a metal ion; and 5) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.