Device and method applicable for measuring ultrathin thickness of film on substrate
US11287253B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2019 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Apr 18, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2223/6116
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure relates to a device and a method for measuring a thickness of an ultrathin film on a solid substrate. The thickness of the target ultrathin film is measured from the intensity of the fluorescence converted by the substrate and leaking and tunneling through the target ultrathin film at low detection angle. The fluorescence generated from the substrate has sufficient and stable high intensity, and therefore can provide fluorescence signal strong enough to make the measurement performed rapidly and precisely. The detection angle is small, and therefore the noise ratio is low, and efficiency of thickness measurement according to the method disclosed herein is high. The thickness measurement method can be applied into In-line product measurement without using standard sample, and therefore the thickness of the product can be measured rapidly and efficiently.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.