Transfer substrate, method of fabricating micro light emitting diode display substrate, and micro light emitting diode display substrate
US11289537B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 12, 2019 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Jan 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/206
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A transfer substrate for transferring an array of a plurality of micro light emitting diodes (micro LEDs) onto a target substrate. The transfer substrate includes a base substrate and an array of a plurality of electroactive actuators. A respective one of the plurality of electroactive actuators includes a ring-shaped frame structure substantially surrounding a central opening, the ring-shaped frame structure made of an electroactive material. The ring-shaped frame structure is configured to undergo a reversible deformation between a first state and a second state upon a change in an electric field applied on the ring-shaped frame structure. A distance between two positions on an inner wall of the ring-shaped frame structure and across the central opening having a first value in the first state and a second value in the second state. The first value is greater than the second value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.