Patent · US Active

Sub-terahertz sub-band flattening feedback

US11290170B1 · kind B1 · utility

1Cited by

0References

79Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Ran Berliner · Yavne, IL
Shay Landis · Hod HaSharon, IL
Yehonatan Dallal · Kfar Sava, IL
Assaf Touboul · Netanya, IL

Key dates

Filing date	Nov 4, 2020
Grant date	Mar 29, 2022
Priority date	—
Expiry date	Nov 4, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH04W24/10
WIPO fieldDigital communication
WIPO sectorElectrical engineering

Abstract

Aspects presented herein may enable a receiving device to receive high frequency signals with a simpler receiver to reduce the overall complexity and cost associated with the receiver. In one aspect, an apparatus receives a reference signal from a second wireless device. The apparatus measures amplitude and phase of the reference signal relative to a set point. The apparatus transmits channel flattening information in a precoding feedback to the second wireless device, the precoding feedback including at least a difference between the amplitude of the reference signal and the set point for a sub-band.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.