Sensor housings, modules, and luminaires incorporating the same comprising a heat sink with heat dissipation structures radially arranged over the outer wall of a sensor housing
US11290621B2 · kind B2 · utility
1Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2020 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Jul 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/52
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.