Multilayer substrate, electronic device, and method of manufacturing multilayer substrate
US11291125B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2020 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Nov 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/06
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer substrate includes a laminate, first and second signal lines, first and second ground conductors, and interlayer connection conductors. The first and second signal lines extend along a transmission direction and include parallel extending portions that extend in parallel or substantially in parallel with each other. The first and second ground conductors sandwich the first and second signal lines in a laminating direction. The first and second ground conductors respectively include a first opening and a third opening between the signal lines when viewed from the laminating direction, and respectively include second openings and fourth openings disposed outside in a width direction orthogonal or substantially orthogonal to the transmission direction in the parallel extending portions when viewed from the laminating direction. The interlayer connection conductors are disposed in the transmission direction and at least between the signal lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.