Methods for manufacturing boards, and profiled element for manufacturing boards
US11292151B2 · kind B2 · utility
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16References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2018 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | May 30, 2040 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F15/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a board as well as a profiled element for manufacturing the board. The method including the steps of providing a material mass including an organic material and a binding agent for binding the organic material together, pressing the material mass so as to form the board, and removing material from the material mass in one or more material zones before pressing so as to obtain after pressing a lower density in those zones compared to the remainder of the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.