Patent · US Active

Systems and methods for creating a honeycomb core with integrated electronic components

US11292225B2 · kind B2 · utility

0Cited by

17References

27Claims

0Family size

Assignee

The Boeing Company · US

Inventors

Jason W. Drexler · Brier, US
Xiaoxi Wang · Xianning, CN
John Christopher Wilde · Mill Creek, US

Key dates

Filing date	Mar 25, 2019
Grant date	Apr 5, 2022
Priority date	—
Expiry date	Nov 23, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1178
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A honeycomb core includes a honeycomb substrate comprised of a number of sheets. A number of traces are printed onto the sheets of the honeycomb substrate. A number of integrated electronic devices are disposed within the honeycomb substrate. The integrated electronic devices are electrically coupled to the traces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.