Thin profile surface mount lighting apparatus
US11293609B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2020 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | May 22, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/0031
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An LED downlighting apparatus includes a housing with a sidewall having a front facing edge and a back facing edge positioned adjacent to a ceiling when the LED downlighting apparatus is installed in an opening of the ceiling. A depth of the sidewall is less than one inch and a thickness of at least a portion of the sidewall is less than three millimeters. An LED board and a lens are coupled to the housing. The lens is disposed with respect to the LED board such that the lens is illuminated from a back side. One or more mechanical couplers snap fit the apparatus to a junction box installed and positioned above the ceiling such that when the apparatus is snap fit to the junction box through the opening of the ceiling, the housing appears to be surface mounted to the ceiling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.