Thermal management systems
US11293673B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2019 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Jan 22, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2700/19
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal management system is described. The thermal management system includes an open circuit refrigeration circuit that has a refrigerant fluid flow path, with the refrigerant fluid flow path including a receiver configured to store a refrigerant fluid, an ejector having a primary flow inlet configured to receive refrigerant, a liquid separator, an evaporator configured to extract heat from a heat load that contacts the evaporator, with the evaporator coupled to the ejector and the liquid separator, and an exhaust line coupled to a vapor side outlet of the liquid separator. In operation, the evaporator in the open circuit refrigeration circuit would be coupled to a heat load.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.