Integrated circuit and method for capturing baseline die temperature data
US11293808B1 · kind B1 · utility
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3References
20Claims
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Key dates
| Filing date | Jun 30, 2021 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Jun 30, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/3177
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method includes, responsive to an application of power to an IC, self-initializing the IC by asserting a reset signal for a reset period. Self-initializing the IC also includes, in response to an expiration of the reset period, deasserting the reset signal. Self-initializing the IC also includes, responsive to deasserting the reset signal, automatically obtaining first temperature data from at least one thermal sensing device associated with a die of the IC, and storing the first temperature data in a storage component of the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.