Additive packaging through smart wrapping of packages and customizations in an on-demand environment
US11294658B2 · kind B2 · utility
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69References
15Claims
0Family size
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Key dates
| Filing date | Nov 26, 2019 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Nov 26, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F16/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Techniques and structures to provide smart packaging in a database environment. A package and a set of customizations corresponding to the package are detected. The package with the set of customizations are bundled to form an additive package such that the additive package provides for the set of customizations to remain bonded with the package throughout one or more processes including testing, deploying, and/or updating of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.