Method and apparatus for micromachining semiconductor material from opposing sides through synchronous coordination of laser and electrochemistry

US11295953B2 · kind B2 · utility

Assignee

• JIANGSU UNIVERSITY · CN

Inventors

• Hao Zhu · Lo Wu, CN
• Zhi-Li Zhang · Minneapolis, US
• Senshan Mao · Zhenjiang, CN
• Shuaijie Zhu · Zhenjiang, CN
• Zhaoyang Zhang · 安丰镇, CN
• Kun Xu · Sunol, US
• Anbin Wang · Chengdu, CN
• Douyan Zhao · Zhenjiang, CN

Key dates

• Filing date: Feb 28, 2019
• Grant date: Apr 5, 2022
• Expiry date: Feb 28, 2039

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C18/12
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An apparatus for micromachining a semiconductor material from opposing sides through synchronous coordination of laser and electrochemistry includes an optical path system, a stable low-pressure jet generation system, and an electrolytic machining system. The optical path system includes a laser generator, a beam expander, a reflector, a galvanometer, and a lens. The electrolytic machining system includes a direct-current pulsed power supply, an adjustable cathode fixture, an electrolyte tank, a current probe, and an oscilloscope. The stable low-pressure jet generation system provides an electrolyte flow into a metal needle. The electrolyte flow forms an electrolyte layer between a semiconductor material and a cathode copper plate, such that the cathode and the anode are in electrical contact with each other. In a method employing the apparatus, a laser beam is irradiated onto the semiconductor material to form a local high-temperature region, which leads to a localized increase in electrical conductivity.