Integrated device package including thermally conductive element and method of manufacturing same
US11296005B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2019 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Sep 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated device package is disclosed. The integrated device package can include a substrate that has an upper side and a lower side opposite the upper side. The integrated device package can include an integrated device die that is mounted to the lower side of the substrate. The integrated device die has a first side facing the lower side of the substrate and a second side opposite the first side. The package can include a molding material in which the integrated device die is at least partially embedded. The package can include a thermally conductive element coupled to the second side of the integrated device die. At least a portion of the thermally conductive element can be exposed through the molding material. The thermally conductive element can be a heat sink. The package can include an interconnect that is configured to provide an external connection. The interconnect extends at least partially through the molding material from the lower side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.