Aluminum-silicon carbide composite and production method therefor
US11296008B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2015 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Aug 4, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An aluminum-silicon carbide composite including flat-plate-shaped composited portion containing silicon carbide and an aluminum alloy, and aluminum layers containing an aluminum alloy provided on both plate surfaces of composited portion, wherein circuit board is mounted on one plate surface and the other plate surface is used as heat-dissipating surface, wherein: the heat-dissipating-surface-side plate surface of the composited portion has a convex curved shape; the heat-dissipating-surface-side aluminum layer has a convex curved shape; ratio (Ax/B) between the average (Ax) of the thicknesses at the centers on opposing short sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.91≤Ax/B≤1.00; and a ratio (Ay/B) between the average (Ay) of the thicknesses at the centers on opposing long sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.94≤Ay/B≤1.00 and production method therefor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.