Fan-out multi-device hybrid integrated flexible micro system and fabrication method thereof
US11296033B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2018 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Dec 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/24137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention discloses a fan-out multi-device hybrid integrated flexible micro-system and an associated fabrication method in the field of microelectronics. The flexible microsystem uses microelectromechanical system (MEMS) chips and/or integrated circuit (IC) chips as the device units, flexible isolation trenches filled with flexible polymer as a flexible connection between the device units, and metal wiring layers to provide electrical interconnections between the device units. The disclosed multi-device hybrid integrated flexible micro-system completed by a fan-out method not only retains excellent electrical performance of silicon-based devices, but also realizes flexibility of the overall micro-system, and has stable structure and reliable performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.