Micro semiconductor chip, micro semiconductor structure, and transfer device
US11296259B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2019 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Apr 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A micro semiconductor chip, a micro semiconductor structure, and a transfer device are provided. The micro semiconductor chip includes an epitaxial structure, a first-type electrode, a second-type electrode and a top light guide element. The epitaxial structure has a top surface, a bottom surface and a side surface. The top light guide element is disposed on the top surface of the epitaxial structure, wherein the top light guide element has a light extraction surface and a bottom surface, wherein the edge of the light extraction surface completely overlaps the edge of the bottom surface of the top light guide element. The light extraction surface is a curved surface, a combination of at least two curved surfaces, or a combination of at least one curved surface and at least one planar surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.