Optoelectronic modules having transparent substrates and method for manufacturing the same
US11296270B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Dec 26, 2018 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | May 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Optoelectronic modules exhibiting relatively small thickness and methods for their manufacture are disclosed. The optoelectronic modules include substrates and transparent covers. Each optoelectronic module includes a transparent substrate on which an optoelectronic component is mounted. The optoelectronic component can be sensitive to and/or operable to generate a particular wavelength of electromagnetic radiation. The transparent substrate is transmissive to the particular wavelength of electromagnetic radiation. In some instances, the transparent substrate is composed, at least partially of glass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.