Bump mounted radiating element architecture
US11296424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2020 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Feb 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/24
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna and manufacturing process for antennas produce radiating elements of desired size for certain frequency bands by bump mounting radiating elements to the printed circuit board substrate. Driving circuitry is stacked to save space. Also, the radiating elements are made using a different dielectric constant material as compared to the substrate. Tiling radiating elements or sub-arrays or radiating elements with bump mounting allows for spatial separation that eliminates surface waves. Bump mounted radiating elements also allow for multiple sizes of radiating elements in which smaller size provides lower directivity to cover broader beam scan performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.