Device attachment with dual band imaging sensor
US11297264B2 · kind B2 · utility
1Cited by
67References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2016 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Dec 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N2013/0088
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. The device attachment may include an infrared imagining module and a non-thermal imaging module that cooperate with one or more of a non-thermal imaging module in an attached device and a light source in the attached device for capturing and processing images.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.