Reference metal layer for setting the impedance of metal contacts of a connector
US11297713B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Nov 20, 2020 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Nov 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09709
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board has an electrical circuit and a connector that is attached to the circuit board. The connector has metal contacts. A housing of the connector has an embedded reference metal layer that is disposed under a single-ended metal contact or differential metal contacts. The reference metal layer sets the impedance of the single-ended metal contact or the differential metal contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.