Heat dissipation module for optical transceiver
US11297734B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 30, 2020 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Jun 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0217
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation module for optical transceiver is provided. The heat dissipation module for optical transceiver includes a liquid cooling device, a casing assembly and an elastic fastener. The liquid cooling device includes a liquid cooling tube and a base, and the liquid cooling tube is in connection with the base. The casing assembly includes a top plate. The top plate includes a top surface, a bottom surface and an opening. The opening is through the top surface and the bottom surface. At least one part of the liquid cooling device is extended into the opening and protruded over the bottom surface. The elastic fastener is configured for fastening the liquid cooling device on the casing assembly, and the liquid cooling device is pluggably fastened to the casing assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.