Active thermal management system for electronic devices and method of achieving device-to-device isothermalization
US11297745B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2019 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Jul 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An active thermal management system for electronic devices comprises: a heat spreader having an internal channel; a thermally conductive body moveably positioned in the internal channel; and two or more electronic devices in thermal contact with a back surface of the heat spreader and positioned adjacent to the internal channel. A location of the thermally conductive body within the internal channel determines a path for heat flow from the back surface to a front surface of the heat spreader. The location of the thermally conductive body within the internal channel may be selected to minimize a temperature differential (ΔT) between the electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.