Bond fixture for leading edge assembly
US11299293B2 · kind B2 · utility
0Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2019 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Jan 15, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C73/24
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A bond fixture includes a frame defining a chamber for receiving a component. At least one bladder assembly is connected to the frame. The at least one bladder assembly includes a pad for contacting the component. A position of the pad relative to the component is controlled by a pressure of the bladder assembly. A caul assembly is adapted to thermally couple to the component to heat a localized portion of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.