Highly-dielectric, elastic structure and a touch sensor including the same
US11299655B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2019 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | May 28, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/006
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A highly-dielectric, elastic structure includes an elastic body that is highly-dielectric and includes a polymer matrix that including 1000 pbw of a polydimethylsiloxane (PDMS) base and 100 pbw of a PDMS curing agent, and has a tensile strength of 0.1 to 10 MPa; and 22.4 pbw of carbon black that is surface-treated with octadecyltrimethoxysilane (ODTMS) in an amount of at least 0.707 mmol per 22.4 pbw of the carbon black, and that is dispersed in the polymer matrix and cured; and an adhesive electrode that is stretchable, that is disposed on the elastic body, and that includes a polymer adhesive including a 500 pbw of a thermosetting silicone-based polymer adhesive including a curable polymer and a curing agent; and a conductive filler comprising 500 pbw of silver particles and 4000 pbw of a carbonaceous material that is a multi-walled carbon nanotube that are dispersed in the polymer adhesive and cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.